有机硅低聚体合成工艺  

Synthetic craft of organosilyl low-molecular polymer

作　　者：杨锐[1] 曹端林[1] 李永祥[1] 

机构地区：[1]中北大学化工与环境学院,山西太原030051

出　　处：《应用化工》2006年第12期943-945,共3页Applied Chemical Industry

摘　　要：采用一甲基三乙氧基硅烷、二甲基二乙氧基硅烷、一苯基三乙氧基硅烷未完全水解制备了含乙氧基的有机硅低聚体。通过正交实验分析确定最佳工艺条件为,原料配比R/S i=1.4,Ph/R=0.2,反应时间为2.5 h,反应温度为80℃。对最佳工艺条件下的有机硅低聚体进行红外光谱表征,低聚体剪切强度可达2.92 MPa。Organosilyl low-molecular polymer was synthesized by methhriethoxysilone, diethoxydimethlsilane,phenyltriethoxysilane. The process was optimized by orthogonal experiment and a better synthetic condition was obtained. The results showed that react 2.5 h at 80℃ and the materials ratio is R/Si = 1.4, Ph/R = 0.2. The polymer performed well prepared under the optimum condition, the product was characterized by IR, and the shear strength can reach 2.92 MPa.

关 键 词：一甲基三乙氧基硅烷 二甲基二乙氧基硅烷 一苯基三乙氧基硅烷 合成 

分 类 号：TQ320.62[化学工程—合成树脂塑料工业]