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作 者:王利[1] 黄英[1] 时刻[1] 王艳丽[1] 高俊宁[1]
机构地区:[1]西北工业大学理学院应用化学系,陕西西安710072
出 处:《电镀与涂饰》2006年第12期52-54,57,共4页Electroplating & Finishing
基 金:航天支撑技术基金资助项目(2002EK1803)
摘 要:比较了氧化钙/乙酸钙用量与亚磷酸根去除率的影响,研究了以乙酸钙为沉淀剂,反应时间、反应温度以及静置时间与亚磷酸根去除率的关系。分析了新配液与再生液的主要成分,通过扫描电镜对比了新配液与再生液的施镀效果。结果表明,乙酸钙处理后的再生废液的施镀效果较好,得到的镀层光亮、均匀。实验得出的最佳工艺条件为:乙酸钙用量2g/(50mL),反应时间100min,反应温度50℃,静置时间12h。The influences of calcium oxide/calcium acetate dosage on phosphite removal rate were compared. Using calcium acetate as precipitator, the influences of reaction time, temperature and standing time on phosphite removal rate were studied. The primary components of new bath and regenerated bath were analyzed, and the plating results of new bath and regenerated bath were compared by SEM. The results show that the regenerated bath using calcium acetate as precipitator has good plating effect, and the deposit is bright and even. The optimal process conditions obtained by experiment are: calcium acetate 2 g/(50 mL), reaction time 100 min, reaction temperature 50℃, standing time 12 h.
分 类 号:TG153[金属学及工艺—热处理]
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