适于IC卡芯片封装带用胶粘剂体系的研究  

Research on Adhesive System Fitted COMS Chip Encapsulation Tape of IC Card

作　　者：沈健 高子亮 武志芳 

出　　处：《电子材料与电子技术》2006年第4期17-20,共4页Electronic Material & Electronic Technology

摘　　要：本文依据IC卡自动生产线对封装胶粘剂技术性能的要求，通过对胶粘剂、助剂、填料等组份的配方体系进行研究，并进行工艺试验。实验结果表明，所选用的胶粘剂及其配方体系满足IC卡封装质量与工艺要求。According to the requirement of technique and performance of adhesive for automatic bounding of IC card,a research on the dispensation system of adhesive, assistant, filing and so on are studied and then the technics experiment is made. Experimental result is showed that the performance of adhesive and the dispensation system of adhesive we selected meet the demand of encapsulating quality and process of IC card.

关 键 词：IC卡 封装腔带 胶粘剂 助剂 填料 

分 类 号：TN405[电子电信—微电子学与固体电子学] TQ437[化学工程]