镍包覆铜复合粉末烧结体界面扩散行为研究  

Investigation of interface diffusion behavior of sintered bulk of nickel-coated copper powders

作　　者：陈学定[1] 刘国瑞[1] 彭彪林[1] 康凯[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃兰州730050

出　　处：《兰州理工大学学报》2006年第6期12-15,共4页Journal of Lanzhou University of Technology

基　　金：国家863计划(2003AA32X150)

摘　　要：利用固相烧结法将镍包铜粉成功地制成了块状烧结体,通过SEM、XRD和EDS研究了烧结过程中镍包铜粉中界面的迁移情况.结果表明,随烧结温度升高,颗粒内原子扩散系数越大,烧结体界面迁移越容易,形成较大的晶粒,同时界面组织也比较均匀.在扩散过程中,由于镍的扩散系数比铜大,镍层扩散进入铜形成了铜镍固溶体,界面呈现单向迁移.The bulk specimens of nickel-coated copper powders were prepared by solid-phase sintering. The interface transport behavior of the nickel-coated copper powders was studied by using SEM, XRD, and EDS. It was shown by the result that the atomic diffusion coefficient of the grains increased with sinte- ring temperature, and the interface of the sintered specimens moved easier. As a result, the grains grew bigger and the interface microstructure became more homogenous. For the bigger diffusion coefficient of the nickel other than that of the copper, the nickel layer would diffused into the copper layer, leading to the forming of Cu-Ni solid solution.

关 键 词：镶包铜复合粉末 烧结 界面 扩散 

分 类 号：TB331[一般工业技术—材料科学与工程]