铜飞片在爆炸加载下的层裂分析  

Dynamic Spalling of Copper Plates under Explosive Loading

作　　者：陶钢[1] 付源辉[1] 崔艳丽[1] 

机构地区：[1]南京理工大学动力工程学院,江苏南京210094

出　　处：《南京理工大学学报》2006年第6期684-687,共4页Journal of Nanjing University of Science and Technology

摘　　要：对紫铜飞片在爆炸作用下的层裂问题进行了试验和理论研究。通过对软回收后的铜板飞片断面进行金相分析,得到层裂面存在沿晶断裂,在层裂面附近有许多微裂纹产生,整个样品内存在大量的交叉滑移带和破碎孪生带的结论。借助LS-DYNA2D程序模拟了铜板在爆炸加载下的层裂过程,计算结果与试验结果基本一致。This paper reports the researches of dynamic spalling problems of copper plates under the explosive loading by the theory and experimental methods. Optical microscopy observations by using soft recovery sampling illustrate the cleavage and intergranular fracture for the spallation. There are a lot of voids （microcracks）, slip bands, and microtwins near the spaUing layers of sampling. The spalling results simulated by LS-DYNA2D hydrocode are consistent with the experimental results.

关 键 词：铜 层裂 爆炸 金相分析 数值模拟 

分 类 号：O382.1[理学—流体力学]