Yb_2O_3粉体化学镀银研究  

The Electroless Plating of Silver on Yb_2O_3 Powder

作　　者：俞洁[1] 鲍小恒[1] 堵永国[1] 吴剑锋[1] 杨光[1] 刘飘[1] 

机构地区：[1]国防科技大学航天与材料工程学院,湖南长沙410073

出　　处：《电工材料》2006年第4期35-39,共5页Electrical Engineering Materials

摘　　要：采用化学镀法制备Ag包覆Yb2O3复合粉末。利用场发射扫描电子显微镜(SEM)研究了还原剂、粉体预处理工艺对Yb2O3表面化学镀Ag镀覆效果的影响。研究了pH值、甲醛浓度、反应温度对Ag还原率的影响。结果表明:采用甲醛为还原剂,在经敏化活化后的Yb2O3粉体表面可以得到均匀致密的镀Ag层;通过调整pH值,选择适当的甲醛浓度,提高反应温度可以提高Ag还原率直至完全还原。The AgYb2O3 composite powders were prepared by electroless plating of silver on ytterbia. The effects of reductant and pretreating process of ytterbia on silver coating homogeneity were studied by means of scanning electron microscope（SEM） . The ratio of reduced silver was influenced by pH value, formaldehyde concentration and reaction temperature. The result shows that homogeneous silver coating on sensitized andactivated ytterbia can be obtained using formaldehyde as reductant. And all the silver ion can be reduced by adjusting pH value, choosing proper formaldehyde concentration and increasing reaction temperature.

关 键 词：化学镀 YB2O3 银还原率 电触点材料 

分 类 号：TM205.1[一般工业技术—材料科学与工程] TB333[电气工程—电工理论与新技术]