电子剪切散斑在检测材料缺陷中的应用  

Application of Electronic Shear Speckle Pattern Interferometry to Nondestructive Evaluation of Materials

作　　者：张伟伟[1] 贺玲凤[1] 顾学甫[1] 

机构地区：[1]华南理工大学交通学院,广州510640

出　　处：《实验力学》2006年第6期753-757,共5页Journal of Experimental Mechanics

摘　　要：随着电子技术、计算机技术的飞速发展,传统的全息干涉技术已经发展到了电子散斑和电子剪切散斑阶段。电子散斑和电子剪切散斑不仅可以完成表面变形量的测量,并且由于它们具有实时性、高灵敏度、非接触性和全场测量等优点,在工业和科研领域中得到了越来越广泛的应用。本文首先介绍了电子剪切散斑干涉的基本原理,然后着重介绍了自行编制的对离面位移的电子剪切散斑图像进行处理的系统。该图像处理系统的主要功能有平滑、区域标记、像素统计等。用该系统对图像进行处理后,可以直接得到缺陷的实际大小。通过对带有已知缺陷模型的实际测量,所得结果与实际吻合较好,说明该图像处理系统是可行的。With the rapid development in electronics and computer technologies, the traditional holographic interferometry has arrived at electronic speckle pattern interferometry （ESPI） and electronic shear speckle pattern interferometry （ESSPI） stages. ESPI and ESSPI not only can measure the surface deformation, but also have the advantages of real time, high sensitivity, non-contact and full field, etc. Consequently, they have led to a real opportunity for more and more applications in the industrial and scientific worlds. This paper introduced the basic principle of ESSPI first, and then presented an ESSPI image processing system about out-of-plane displacement developed by the authors in detail. The main functions of the system include ambiguity, sign of region, statistics of pixel, etc. Using the system, the ESSPI images were processed and the area of the defect was determined directly. The processed results for a sample with some known defect are well agreed with the actual defects. Therefor the present ESSPI image processing system is reliable.

关 键 词：电子剪切散斑干涉 非破坏评估 图像处理 面积测量 

分 类 号：TH744.3[机械工程—光学工程]