液晶显示玻璃基板激光切割技术的实验研究  

A Study of cutting LCD glass substrates by laser

作　　者：叶圣麟[1] 黄鑫[2] 马军山[1] 唐武[2] 肖明强[2] 

机构地区：[1]上海理工大学光学与电子信息工程学院,上海200093 [2]上海激光技术研究所上海市激光束精细加工重点实验室,上海200233

出　　处：《应用激光》2006年第6期401-404,共4页Applied Laser

基　　金：上海市科学技术委员会科研计划项目(05QMB1424)资助

摘　　要：与传统的切割方式相比,可控断裂激光切割技术具有切割断面平滑、一次成型、对原材料性质和形态影响较小等特点。采用该技术,从断裂基理和实验验证两方面对激光切割液晶显示玻璃基片进行了一定的研究。研究结果表明,增大光斑尺寸,可减少断面上的热影响区,提高切割质量；但光斑尺寸过大,会降低激光功率密度,增大输出功率；冷却流量的增大及冷却点与激光光斑距离的减小,均可增大拉应力值,使玻璃表面的裂纹迅速扩展直至断裂,有利于激光切割。在不影响切割质量的前提下,预划一定深度和长度的初始裂纹是一个提高激光切割效率的方法。Compared with traditional methods, the technique of laser cutting with controlled fracture is characterized by smooth separation surface, once forming and small effect on material＇s property and shape. By using this method, the technique of laser cutring LCD glass substrates is studied both in fracture mechanism and experiment. The results showed that the heat affected region will be reduced with enlarging the size of laser spot and the quality of cutting will be improved. But when the size is too larger, density of laser power will be decreased and input power will be increased. To increase tensile stress and make crack fracture, cooling flux can be enhanced and the distance between cooling point and laser spot can be decreased. Scribing initial crack with suitable depth and length can improve the efficiency of laser cutting on condition that the quality is ensured.

关 键 词：激光技术 玻璃基片 可控断裂 初始裂纹 

分 类 号：TG485[金属学及工艺—焊接]