化学镀锡液中添加剂的影响研究  

Effect of Additives in Eleclroless Tin Plating Bath on Electrode Process and Gulling Properties

作　　者：孙武[1] 李宁[1] 苏晓霞[1] 赵杰[1] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001

出　　处：《材料保护》2007年第1期35-38,共4页Materials Protection

摘　　要：所选定的化学镀锡液体系为硫酸盐体系，用浓度一电位曲线研究了不同配位剂对铜电极电位和锡电极电位的影响，并通过镀锡层厚度测定和表面形貌观察研究了化学镀锡液中不同种类的表面活性剂和抗氧化剂对镀层的影响。分别给出了在化学镀锡液中选择各种添加剂的方法，提出了化学镀锡液体系的最佳配方为：20～40g／L硫酸亚锡，30～60mL／L浓硫酸，80～120g／L硫脲，60～100g／L次亚磷酸钠，1．0～3．0g／L表面活性剂，2．0～5．0g／L对苯二酚。Theeffects of various complexing agents on the potential of Cu and Sn electrodes in elect roless tin plating from a sulfate bath were investigated using concentrahon-polential curves. The thickness of the resulting Sn coating was measured, while its morphology was observed as well, aiming at revealing the effects of various surfactants and antioxidants on the structure and properties of the Sn coating. Moreover, the methods for the selection of various additives for eleclroless tin plating were briefed. It was found that the target electroless Sn coating of desired properties could he obtained using an optimized formulation and optimized electroless plating parameters.

关 键 词：化学镀锡 配位剂 电极过程 镀层性能 

分 类 号：TQ153[化学工程—电化学工业]