基于ANSYS的COG邦定机压头热应变分析  

Analysis on the Thermal-stain of Press Part on COG Bonding Machine with ANSYS

作　　者：龙海强[1] 郭文谦[1] 徐健[1] 田兴志[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所

出　　处：《制造技术与机床》2007年第2期39-41,共3页Manufacturing Technology & Machine Tool

摘　　要：邦定机压头是拾取芯片进入CCD物方视场进行图像识别采样并最终完成热压接的重要部件。利用ANSYS软件成熟的热应力分析功能分析并获得了压头热变形理论值,结合实际测量验证了有限元分析结果,以理论分析结果进行压头调节获得了较理想的IC标识CCD图像识别效果。The press part is an important components in COG bonding machine, with an IC, the part moves into the CCD view field to get the image sample and felts the IC onto the LCD screen accurately. This paper introduces the finite element method （FEM ） with ANSYS software to calculate the thermal - structural deformation of the part, and the practical measurement result proves the finite element analysis, and with the analysis result to modify the position of the part we can get the proper image sample easily.

关 键 词：COG邦定机 ANSYS 热应变 有限元 

分 类 号：TP311[自动化与计算机技术—计算机软件与理论]