铝-铜轧制复合工艺及界面结合机理  

Al-Cu Compound and Bonding Mechanism by Rolling Process

作　　者：王小红[1] 唐荻[1] 许荣昌[1] 温永红[1] 

机构地区：[1]北京科技大学高效轧制国家工程研究中心,北京100083

出　　处：《有色金属》2007年第1期21-24,共4页Nonferrous Metals

基　　金：国家自然科学基金资助项目(50375019)

摘　　要：通过不同的压下率和不同的扩散退火温度试验,利用金相显微镜,力学实验机、扫描电镜等仪器,研究在室温条件下铝-铜轧制复合工艺,探讨界面结合机理。结果表明,在室温轧制条件下,采用75%的压下率,轧后采用300℃,保温30min的扩散退火处理为理想的轧制复合工艺。组元压下率和总压下率成正比关系,变化趋势相同,组元变化率差值随总压下率的增大而减小,变形抗力趋于一致,有利于轧制复合。The technology of roiling compound of Al-Cu under room temperature is investigated and the bonding mechanism is discussed by experiments for different the rate of deformation and the temperature of thermal treatment with the help of the optical microscope, mechanical equipment, scanning electron microscope. The results show that the ideal technological parameters for rolling compound of Al-Cu under room temperature are 75 % deformation rate, annealing at 300℃ preservation for 30min diffusion. The deformation rate of the components is in direct proportion with integer deformation rate, and in the same variation tendency. The deformation rate difference between the components is decreased with the increase of the integer deformation rate, and the strength to resist the deformation tend to interconsistency, this is helpful to rolling and compounding.

关 键 词：金属材料 Al-Cu轧制复合 结合机理 扩散退火 

分 类 号：TG335.8[金属学及工艺—金属压力加工] TG146.11[一般工业技术—材料科学与工程]