光固化快速成形光敏树脂临界曝光量和透射深度的测试研究  

Determination of the critical exposure and the penetration depth of the photosensitive resin for Stereolithography

作　　者：黄笔武[1] 黄伯芬[1] 谌伟庆[1] 吴立传[1] 

机构地区：[1]南昌大学材料科学与工程学院,南昌330031

出　　处：《信息记录材料》2007年第1期59-62,共4页Information Recording Materials

摘　　要：光固化快速成形是基于光敏树脂在特定波长紫外激光照射下发生光固化反应这一特性而发展起来的。本文对自制备的光敏树脂的临界曝光量和透射深度这两个特性参数进行了测试研究,测得临界曝光量为8.8m J/cm2,透射深度为0.124mm。参照所测的自制的光敏树脂的这两个特性值,选定快速成形设备(HRPL-I)的运行工艺参数,用自制的光敏树脂进行制作零件实验,其制作效果较好。Stereolithography is developed on the basis of the liquid photosensitive resin with the UV -laser curing characteristic. The critical exposure （Ec） and the penetration depth （Dp） of the prepared photosensitive resin were determined, and its critical exposure is 8. 8mJ/cm^2 , its penetration depth is 0. 124mm. Acording to the determined two values, some parts were fabricated by selecting the processing parameters of the Stereolithography Apparatus （HRP-I）, and the quality of the fabricated parts was good .

关 键 词：快速成形 光敏树脂 临界曝光量 透射深度 

分 类 号：TQ314.243[化学工程—高聚物工业]