绝缘体孔径对接成型工艺及注射模设计  

Molding Technology of Hole Butting and Design of Injection Mold for the Insulator

作　　者：林剑[1] 张军华[1] 

机构地区：[1]郑州航天电子技术有限公司,河南驻马店463000

出　　处：《模具制造》2007年第2期43-45,共3页Die & Mould Manufacture

摘　　要：通过对绝缘体结构及成型工艺要求的分析,介绍了一种利用顶板顶出及模具设计中采用型芯对接结构,并对工艺难点进行了研究。并指出了模具设计结构特点和设计要点及制造过程中应注意的问题及解决方法,提高产品质量和模具制造质量。Through analyzing on the structure and injection molding technology requirement of insulator, using ejection plate and adopting the core butting mechanism in the mold design are introduced, and researching on the technology difficulties.the mold structure characteristic, design points, the question paid attention to and the solution in the machining process are pointed, the quality of produce and mold are improved.

关 键 词：绝缘体 成型工艺 模具结构 型芯对接 

分 类 号：TQ320.5[化学工程—合成树脂塑料工业]