高气密性Mo-Cu-Ni瓷封合金  

Microstructure and the Properties of Mo-Cu-Ni Hermetic Alloy

作　　者：夏扬[1] 韩胜利[1] 崔舜[1] 宋月清[1] 林晨光[1] 

机构地区：[1]北京有色金属研究总院,北京100088

出　　处：《真空电子技术》2006年第4期36-39,共4页Vacuum Electronics

摘　　要：采用粉末冶金工艺制备了相对密度达99.97%的Mo-Cu-Ni合金,研究了合金的结构、物理性能、力学性能及加工性能。结果表明:经特殊工艺处理后合金气密性极高。合金以Mo为基,Cu,Ni互扩散形成Cu3.8Ni粘结相分布在Mo颗粒边缘,其热膨胀系数与95%Al2O3瓷相近,导电导热性能良好,具有中等强度、较好的延伸率和切削加工性能。用作封接件时合金气密性与其它工艺性能达到苛刻使用条件要求。Mo-Cu-Ni alloys with a density up to 99.97 % of the theoretical were made by P/M technology. Mierostructures and properties including physical, mechanical as well as technological properties were investigated. The results indicated that after speeial teehnical process Mo-Cu-Ni alloy was found to be entirely densified. The alloy was consisted of Mo matrix phase and Cu3.8Ni binder phase whieh distributed around the matrix. The expansion coefficient of Mo-Cu-Ni ceramic hermetic materials was demonstrated to be close to that of 95 % alumina, and the electro-conductivity and thermal-conductivity were excellent either. In addition, a good match in moderate strength and preferable elongation was presented. Later work carried out on welding subassemblies proved that air tight seal and technological performance of the alloy had achieved the rigorous applied requirements

关 键 词：高气密性 Mo-Cu—Ni 封接合金 热膨胀系数 工艺性能 

分 类 号：TG13[一般工业技术—材料科学与工程]