微米级镀银铜粉的镀层结构及热稳定性  

Plating Structure and Thermal Stability of Micro Silver-coated Copper Powder

作　　者：袁颖[1] 宋佩维[2] 赵康[3] 

机构地区：[1]西安理工大学高等技术学院,陕西西安710082 [2]陕西理工学院机械工程学院,陕西汉中723003 [3]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《表面技术》2007年第1期11-13,共3页Surface Technology

摘　　要：为了提高铜粉的热稳定性,采用滴入化学镀法在铜粉末表面包覆一层金属银,用SEM、X射线衍射(XRD)、粒度分布和热重分析表征了不同包覆厚度的镀银铜粉和原始铜粉的表面形貌、表面结构及抗氧化性。结果表明:铜粉表面镀层结构与银离子形核长大机制和银含量有关;镀银铜粉的热稳定与表面镀层结构有关;完全包覆结构的镀银铜粉具有较好的热稳定性,抗氧化温度可以达到800℃以上。The micro silver-coated copper powder with high temperature of oxidation resistance was prepared by chemistry substitutional and chemistry plating reaction. The surface topography, microstructure and oxidation resistance of the coated powder were characterized by SEM, XRD, TG and other methods. It is found that the ploating structure of copper power is related to mechanism of nucleus forming and content of silver; Thermal stability is affected by plating structure of silver-coated copper power. Silver-coated copper powder with coated structure have higher thermal stability, it is not oxidized even at 800℃.

关 键 词：铜粉 镀银 热稳定性 镀层结构 

分 类 号：O614.121[理学—无机化学] TQ153.1[理学—化学]