电沉积超细Cu粉粒径控制机制研究  

~tudy on Size Control Mechanism of Fine Copper Powder

作　　者：李维[1] 喻建胜[1,2] 杨彦明[1] 蒋渝[1] 

机构地区：[1]四川大学材料科学与工程学院,四川成都610065 [2]四川石油管理局技术检测中心,四川广汉618300

出　　处：《中国材料科技与设备》2007年第1期67-69,共3页Chinese Materials Science Technology & Equipment

摘　　要：本文探讨了电沉积过程中超细铜粉的粒径控制机制。结果表明：电流密度、pH值的改变对阴极过电位影响显著，电解液浓度的改变对阴极过电位无显著影响；而过电位的变化直接引起粉体粒径的变化；在阴极过电位高的条件下。粉体粒径较小，而在阴极过电位低的条件下，粉体粒径较大，通过控制过电位可以实现对超细铜粉粒径的控制。The article discusses the dimension control mechanism of ultra - fine copper powder in the preparation of electrodeposit. As a result, to chang the current density, pH have huge influence on cathodal overvoltage, to alter electrolyte concentration have little influence on cathodal overvoltage, and to chang the overvoltage will change the dimension of the powder directly. On the condition of high overvoltage. The dimension of copper powder is small, while on the condition of low overvohage. The dimension is small. It is concluded that size control can be achieved by control the overvohage.

关 键 词：电沉积 超细Cu粉 过电位 粒径 

分 类 号：TB383[一般工业技术—材料科学与工程]