退火温度对Ti_(53.5)Ni_(22.8)Cu_(23.7)合金快速凝固条带组织的影响  

Effect of annealing temperature on the microstructure of rapidly-solidified TiNi-Cu alloy ribbons

作　　者：何文军[1] 闵光辉[1] 奥列格.托罗辛科 于化顺[1] 

机构地区：[1]山东大学材料科学与工程学院,山东济南250061 [2]圣彼得堡国立工业大学材料科学系,俄罗斯圣彼得堡195251

出　　处：《功能材料》2007年第2期261-264,共4页Journal of Functional Materials

基　　金：国家外专局聘请外国专家重点资助项目(20050360646)

摘　　要：采用快速凝固法制备了Ti53．5Ni22.8Cu23．7合金薄带，对快速凝固合金条带在不同温度下退火热处理态的微观结构进行了X射线衍射和TEM分析。结果表明，在450℃退火处理时，合金组织为B19、B2和条状析出物共存，条状析出物与基体呈共格关系，宽约为10～15nm；500℃退火以后形成纳米多晶B19和单晶B19的混合组织；Ti2（Ni＋Cu）析出物在高于550℃以上温度退火时形成，其晶粒尺寸随温度升高长大，板条宽由30～50nm变化到200～300nm；在650℃退火态下，Ti2（Ni＋Cu）晶粒进一步长大并影响马氏体的形貌，局部区域高密度晶界相互叠加形成莫尔条纹。Ti53.5 Ni22.8 Cu23.7 shape memory alloy rlbbons have been fabricated by rapid solidification and then the effect of annealing temperature on their microstructures was investigated. The microstructure is very sensitive to the annealing temperature. The plate precipitates with width of 10 to 15nm has coherent relationship with the matrix when annealed at 450℃. When annealed at 500℃, the microstructure is coexistence of nanocrystalline B19 and single-crystalline B19. Ti2 （Ni＋ Cu） precipitates were formed when annealing temperature is higher than 550℃. The width of plate Ti2（Ni＋Cu） precipitates increases from 30 to 50nm to 200 to 300nm with increasing annealing temperature. When annealed at 650℃, the martensite morphology was influenced by the distributions of Ti2 （Ni＋Cu） precipitates and moire fringe can locally be formed due to high density of over lapping irregular structured grain boundaries.

关 键 词：快速凝固 TiNi-Cu合金 退火温度 显微组织 

分 类 号：TG146.2[一般工业技术—材料科学与工程]