热压态Al_2O_3弥散强化铜的组织研究  被引量:3

Study on Microstructure of Hot-extruded Dispersion-strengthed Al_2O_3 /Cu Composite

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作  者:张晓楠[1] 张旦闻[2] 赵冬梅[1] 董企铭[3] 刘平[1] 任凤章[1] 田保红[1] 

机构地区:[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]洛阳大学,河南洛阳471003 [3]河南工业大学,河南郑州450052

出  处:《热加工工艺》2007年第2期7-9,共3页Hot Working Technology

基  金:河南省重点攻关项目(50571035)

摘  要:用Cu_2O粉作氧化剂,采用简化的内氧化工艺,在900℃下使Cu-Al合金薄平板内氧化,获得Al_2O_3/Cu复合材料。然后采用热挤压法制取了Al_2O_3/Cu复合材料,对其显微组织和拉伸断口及界面进行观察与分析。结果表明:增强颗粒在基体中分布均匀,细化了晶粒,压制后组织进一步致密细化,且该材料具有良好的热稳定性;拉伸断口有韧窝断裂;能谱分析表明,板表面之间存在元素的扩散,热力学分析表明界面上有化学结合,界面结合状态较好。且复合层中Al_2O_3颗粒呈弥散状分布;复合层表面和内部的晶粒大小明显不同,表面晶粒较小。Using a brief internal oxidation manufacturing process, taking Cu2O as oxidizer,Al2O3/Cu composite were prepared through internal oxidation of Cu-Al alloy plate at 900℃. And then Al2O3/Cu composite were prepared through hot-extruded, the microstructure, tensile fracture and interface were observed and analyzed. The results show that Al2O3 particles distribute homogeneously, which fines the grains, the microstructure of the alloy is denser and finer after pressing. Al2O3 /Cu composite has a good thermal stability.The tensile fracture is dimple cleavage. EDX analysis reveales that element diffusion occures on the Al2O3/Cu interface. According to the thermodynamic analysis, chemical bonding may be present on the interface, which is beneficial for the interface bonding.And Al2O3 particles are dispersal distribution,the size of grains on surface layer is different obviously form inside,the grains on the surface of the composite layer are smaller,

关 键 词:内氧化法 AL2O3/CU复合材料 显微结构 拉伸 

分 类 号:TB332[一般工业技术—材料科学与工程]

 

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