X射线法测量微晶玻璃残余应力的误差分析  

Analysis on Errors of Measuring Residual Stress in Glass-ceramic with X-ray Diffraction

作　　者：谢俊[1] 程金树[1] 陆平[1] 全健[1] 

机构地区：[1]武汉理工大学硅酸盐材料工程教育部重点实验室,武汉430070

出　　处：《武汉理工大学学报》2007年第2期23-25,共3页Journal of Wuhan University of Technology

基　　金：国家自然科学基金(50272043)

摘　　要：探讨了X射线法测量微晶玻璃残余应力的原理及该方法对残余应力值精确度的影响。采用不同的衍射角对微晶玻璃的应力进行测试,对应力结果进行了比较,分析了应力产生误差的原因。发现选择较高的衍射角并延长衍射时间,测试中各应力值点与用最小二乘法所拟合出的直线之间的偏差较小,这说明各点的线性和相关性较好,可以减小X射线法残余应力测试的误差。Probe into theory of X-ray diffraction testing residual stress in glass-ceramic and effect on accuracy of stress with the X-ray diffraction. In this paper, residual stress was measured with different diffraction angle, then the errors and caused reasons were analyzed by contrasting the testing results. The results showed that the stress line was fitted with the least square calculator, in other ways, it means that error of measurement decreased when diffraction angle and prolong diffraction time were increased.

关 键 词：残余应力 误差分析 X射线衍射法 微晶玻璃 

分 类 号：TB321[一般工业技术—材料科学与工程]