材料表面之间黏附过程分析  

Analysis of adhesion process between material surfaces

作　　者：卿涛[1] 邵天敏[1] 温诗铸[1] 

机构地区：[1]清华大学摩擦学国家重点实验室,北京100084

出　　处：《物理学报》2007年第3期1555-1562,共8页Acta Physica Sinica

基　　金：国家重点基础研究发展计划973项目(批准号:2002CB716201);;国家自然科学基金(批准号:50475012)资助的课题.~~

摘　　要：对两材料表面黏附过程进行了理论分析,得出了跳触距离的计算公式,发现跳触距离与试样的几何尺寸和系统的刚度有关,而且也受到相对湿度的影响.利用单峰接触模型和幂律流体的本构方程,对材料表面吸附的水膜进行了动力学分析,改进了描述拉开力和停留时间关系的方程.并利用自制的黏附力测试装置对跳触力和拉开力进行了测试和分析.In this paper, adhesion process of two material surfaces was analyzed. Formulas for calculating jumping distance were deduced. The results of analysis showed that the jumping distance was retated to the radius of spheres, elastic modulus of the spring and the relative humidity. Effect of relative humidity was also discussed. Basing on single asperity model and the constructive equations for power-law fluid, the formulas for describing the relationship between pull-off force and the rest time were improved. Jump-to-contact force and pull-off-force were measured by a self-buih adhesion apparatus.

关 键 词：黏附 范德华力 相对湿度 水膜 

分 类 号：O313.5[理学—一般力学与力学基础]