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作 者:成月[1] 童庆松[1] 施继承[1] 程林[1] 黄熠[1] 郑立群[1]
机构地区:[1]福建师范大学化学与材料学院,福州350007
出 处:《无机化学学报》2007年第3期456-460,共5页Chinese Journal of Inorganic Chemistry
基 金:教育部重点资助项目(No.03065;JA02159);福建省自然科学基金项目(No.E0510014);福建省科技厅项目(No.2005K012)资助
摘 要:将碱性镀液中制备的锡.铜膜在不同温度下烧结,制得几种锡铜合金负极材料。研究表明,在200℃烧结的锡铜合金具有单斜CucSns(C2/c空间群)型结构,晶胞体积大。在充放电过程中结构稳定。在0.03~2.0V电压区间,该样品第1循环的放电容量为503mAh·g^-1,40次循环的容量衰减率为33%。随着充放电循环的进行,放电电压平台略有升高。电荷传递阻抗是控制样品放电过程的主要因素。原子力显微图像表明,样品的表面是由高120nm、直径20~50nm的圆柱状颗粒组成。By sintering the tin-copper films electroplated from an alkaline solution under different temperatures, several kinds of the tin-copper alloy negative electrodes were prepared. The results show that the tin-copper alloy sintered at 200 ℃ with a monoclinic structure of Cu6Sn5 (Space group: C2/c ) exhibits large crystal cell and stable structure during the charge-discharge cycles. The sample exhibits a discharge capacity of 503 mAh·g^-1 in the 1st cycle and the capacity fade rate is 33% after 40 cycles in the voltage region of 0.03 to 2.0 V. The voltage on the discharge platform is gradually raised during the charge-discharge cycles. The charge transfer impedance is a main factor to control discharge process. The atom force microscope image shows that the sample particles are cylinder with a height around 120 nm and a diameter around 20 to 50 nm.
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