铜合金表面Ni基铸渗层的热疲劳行为研究  

The Thermal Fatigue Research of Ni-Based Infiltrated Layer on Copper Substrate

作　　者：宋文明[1] 杨贵荣[1] 刘洪峰 郝远[1] 马颖[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室 [2]酒钢机械制造公司,甘肃嘉峪关735100

出　　处：《铸造》2007年第2期145-147,共3页Foundry

摘　　要：研究了铜基表面镍基渗层的热疲劳性能。结果表明:热循环次数小于20次时,渗层表面主要产生氧化,无裂纹产生;当热循环次数超过50次时,渗层与基体的结合界面处以及渗层的表面会产生微裂纹,渗层越厚,渗层与基体的结合界面处出现微裂纹的时间越早;多次热循环后在渗层与基体的结合处出现蚀坑,渗层的损伤形式主要为应力腐蚀。Thermal fatigue property of Ni-based infiltrated layer on copper substrate has been investigated： Oxidation happened on the surface of infiltrated layer when thermal cycling times was less than 20, and no cracks was observed. While, micro-cracks appeared at the interface between the infiltrated layer and the substrate, as well as on the surface of the infiltrated layer when the thermal cycling times was beyond 50. The thicker of the infiltrated layer, the earlier time of appearing micro-cracks was. The corrosion pit appeared at the interface between the infiltrated layer and substrateo The damage mechanism of infiltrated layer tested was stress corrosion.

关 键 词：镍基渗层 热疲劳 应力 蚀坑 

分 类 号：TG156.8[金属学及工艺—热处理]