X波段三维LTCC1/4功分器的试验研究  

Study of X Band 3D LTCC 1/4 Divider

作　　者：徐鸣[1] 严伟[1] 

机构地区：[1]中国电子科技集团公司第十四研究所,南京210013

出　　处：《微波学报》2007年第1期47-51,共5页Journal of Microwaves

摘　　要：低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。文中设计了一个X波段三维结构LTCC 1/4功分器,面积仅为10×15mm2,比常规相同波段1/4功分器体积减少了1/3。利用三维电磁场分析软件HFSS对功分器三维结构进行了建模分析和仿真优化,仿真优化结果较好,试验样品的测试结果与仿真结果基本吻合。Low temperature co-fired ceramics （LTCC） becomes an important packaging and interconnecting technology for realizing microwave circuit and system＇s miniaturization and higher density. In this paper, an X band 3D structural LTCC 1/4 divider was designed, and the size of the sample is only 10 × 15mm^2, which is decreased 1/3 of general X band 1/4 divider. The divider was simulated and optimized by using 3D electromagnetic analyzing software HFSS, good results were acquired, and the testing results of the experimental sample was mainly agreement with the simulated results.

关 键 词：低温共烧陶瓷(LTCC) 三维结构 功分器 

分 类 号：TN626[电子电信—电路与系统]