基于影像板的X射线应力测试新技术  

A NEW TECHNIQUE FOR X-RAY STRESS MEASUREMENT BASED ON USING IMAGE PLATE

作　　者：洪波[1] 姜传海[1] 

机构地区：[1]上海交通大学材料科学与工程学院教育部高温材料及高温测试重点实验室,上海200030

出　　处：《理化检验（物理分册）》2007年第2期78-80,共3页Physical Testing and Chemical Analysis(Part A:Physical Testing)

摘　　要：介绍了一种X射线应力测试新技术,基于X射线衍射原理与影像板平面探测器背反射几何,推导出应力测试基本公式,并列举了应用实例。结果证实,该方法具有测试速度快及结果可靠等优点。A new technique for X-ray stress measurement has been introduced. The formula of calculating stress are inferred according to the theory of X-ray diffraction and the geometry of back-reflection for X-ray area detector, called an imaging plate （IP）. According to the result of the example obtained by the present method, there are some advantages, rapid plane stress analysis and credible measured value.

关 键 词：影像板 应力测试 X射线衍射 

分 类 号：TG115.222.2[金属学及工艺—物理冶金]