颗粒增强铜基复合材料的选区激光烧结制备  

Fabrication of particle reinforced copper matrix composites by selective laser sintering

作　　者：顾冬冬[1] 沈以赴[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《复合材料学报》2007年第1期53-59,共7页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金委员会-中国工程物理研究院联合基金项目(10276017);航空科学基金项目(04H52061);南京航空航天大学科研创新基金项目(S0403-061)

摘　　要：利用选区激光烧结制备了亚微米WC-10%Co颗粒增强Cu基复合材料。利用X射线衍射仪、扫描电镜及原子力显微镜表征了激光烧结试样的显微组织。结果显示:WC增强颗粒或部分熔化且圆滑化,或完全熔化且原位析出;与基体具有连续相容的冶金结合界面。研究了工艺参数(激光功率、扫描速率、铺粉厚度)对烧结试样组织及性能的影响。结果表明,增加激光功率能改善增强颗粒与基体的界面结合性能。激光扫描速率大于0.05 m/s时,能提高增强颗粒分散均匀性。铺粉厚度降至0.30 mm以下,有利于提高烧结成形致密度。The sub-micro WC-10 %Co particle reinforced Cu matrix composites were prepared using selective laser sintering （SLS）. The microstructures of the laser sintered samples were characterized by X-ray diffraction （XRD）, scanning electron microscope （SEM）, and atomic force microscope （AFM）. It shows that the WC reinforcing parti- cles are either partially melted and smoothened or completely melted and in situ precipitated, showing continuous and compatible metallurgical interfaces with the matrix. The effects of the processing parameters such as laser power, scan speed, and layer thickness on the microstructures and properties of the laser sintered samples were investigated. It shows that increasing the laser power leads to an improvement in the bonding ability between the reinforcing particles and the matrix. An increase in the scan speed above 0. 05 m/s results in a homogeneous distribution of the reinforcing particles. Reducing the layer thickness below 0. 30 mm permits a high densification of the laser sintered part.

关 键 词：选区激光烧结 金属基复合材料 颗粒增强 显微组织 WC—Co 

分 类 号：TG14[一般工业技术—材料科学与工程] TB331[金属学及工艺—金属材料]