铜、银双组分无机抗菌材料的制备和性能研究  

Preparation and capability study of Cu-Ag bi-component inorganic antibacterial material

作　　者：张彬[1] 唐晓宁[2] 张皓东[3] 

机构地区：[1]昆明理工大学理学院 [2]昆明理工大学材料与冶金工程学院 [3]昆明理工大学环境科学与工程学院,昆明650093

出　　处：《化工新型材料》2007年第2期73-75,共3页New Chemical Materials

基　　金：云南省自然科学基金资助项目(2002B0006Q);昆明理工大学校青年基金资助项目(2006-27)

摘　　要：采用溶胶-凝胶法制取白炭黑载体,在一定条件下,将具有杀菌性能的Cu2+、Ag+附着在白炭黑载体上,制得含Cu2+、Ag+双组分杀菌活性成分的无机粉体抗菌材料。运用ICP、粒度分布仪和FTIR等手段对材料中抗菌离子含量、粒度以及抗菌离子与载体的结合方式等进行了表征。并利用菌落计数法对材料的抗菌性能进行研究。结果表明,Cu-Ag双组分抗菌白炭黑中,抗菌离子含量高于单组分抗菌白炭黑;其中,Cu2+是通过离子交换方式结合到白炭黑上的,而Ag+是通过离子交换和吸附两种方式结合到白炭黑上;材料的杀菌率达99%以上;粒径<7μm且均一。The carrier was prepared by the sol-gel method, and the bi-component inorganic antibacterial material was synthesized by supporting Cu^2＋ and Ag^＋ on the carrier under certain condition. The structures and properties of the material were characterized by ICP, particle size measurement instrument, FTIR and enumeration tests. The results showed that the antibacterial ion contents in the material was higher than in the single component material. The Cu^2＋ bonded to white carbon black by ion exchange process while the Ag^＋ bonded to white carbon black not only by ion exchange process but also adsorption. Sterilizing ratio was over 99%, the particle size was homogeneous and can be further decreased to 7 μm. The antibacterial mechanism was also discussed.

关 键 词：无机抗菌材料 白炭黑 复合离子 性能研究 

分 类 号：TB39[一般工业技术—材料科学与工程]