C194铜合金的强化机制概述  

Review on Strengthening Mechanism of C194 Copper Alloy

作　　者：刘凯[1] 柳瑞清[1] 谢春晓[1] 

机构地区：[1]江西理工大学材料与化学工程学院,江西赣州341000

出　　处：《热处理》2007年第1期24-28,33,共6页Heat Treatment

摘　　要：引线框架是集成电路中的一个关键组成部分,近年来,引线框架材料得到了极大的发展。论述了引线框架铜合金的设计思路,介绍了不同高强高导铜合金的强化机制和导电原理,并分析了C194铜金合金的强化机制。The lead flame is a key component of integrated circuit. Materids used for the lead frame has been considerably developed in recent years . Various design concepts of copper alloys for the lead frame were reviewed, and the strengthening mechanism and the electric conduction principle of different high-strength and high-conductivity copper alloys introduced,with the strengthening mechanism of C194 copper alloy being analyzed.

关 键 词：引线框架 C194铜含金 含金化法 导电原理 强化机制 

分 类 号：TG146.11[一般工业技术—材料科学与工程]