聚丙烯化学镀Ni-Cu-P复合导电粉末制备工艺研究  

Study on Compound Electric Conductive Powder of Electroless Ni-Cu-P Plating on Polypropylene

作　　者：陈奎儒[1] 

机构地区：[1]西南科技大学制造科学与工程学院,四川绵阳621010

出　　处：《涂料工业》2007年第3期45-46,50,共3页Paint & Coatings Industry

摘　　要：选用轻质聚丙烯粉末作芯材,在其表面化学镀覆Ni-Cu-P合金,制备出了复合导电粉末。针对聚丙烯化学稳定性好、憎水性强的特点,采用了特殊的镀前处理方法。测试结果表明镀层表面质量良好、电阻率较低,镀层电阻率随镀层中铜含量增加而降低。The title compound electric conductive powder of electroless Ni - Cu - P plating on polypropylene was studied. Results showed that this kind of compound powder has the good electrical conductivity and surface quality and small proportion. The coating electronic resistivity reduces along with increase of copper content in the coatings. The essential technology is the pretreatment of the substrate material and the adjustment of pH value of the plating solution.

关 键 词：聚丙烯 化学镀 NI-CU-P 复合粉末 

分 类 号：TQ630.49[化学工程—精细化工]