有机硅改性酚醛环氧树脂耐高温胶粘剂的研制  

Preparation of phenolic epoxy resin high-temperature resistance adhesives modified with silicone

作　　者：王丁[1] 程斌[1] 刘峰[1] 江民涛[1] 黄朝[1] 

机构地区：[1]江西省科学院应用化学研究所,江西南昌330029

出　　处：《中国胶粘剂》2007年第3期23-27,共5页China Adhesives

摘　　要：采用甲基苯基硅树脂对酚醛环氧树脂进行改性,硼酚醛树脂与自制固化促进剂作为固化剂,辅以纳米蒙脱土、绢云母粉作为填料,制备出一种能在300℃条件下长期使用的耐高温胶粘剂。在不同的配方及固化工艺条件下測定了有机硅改性酚醛环氧树脂体系的剪切强度,分析了甲基苯基硅树脂／酚醛环氧树脂比例关系、硼酚醛树脂与自制固化促进剂比例关系、固化剂用量、固化工艺条件、纳米蒙脱土的加入量对体系的影响。In this paper,an adhesive made from phenolic epoxy resin modified with the methyl-phenylsilicon resin was introduced. In this course,boron phenolic resin and curing accelerator by custom-made were chosen as curing agents,nano-montmorillonite and sericite powder as fillers,adhesive can be served at 300 ℃ for long period. The shear strengths of phenolic epoxy resin modified with organic silicon that different formulas and curing conditions were measured .The influences of curing conditions,the amounts of curing agent,the ratio of phenolic epoxy resin and methyl-phenyl-silicone resin,the ratio of boron phenolic resin and curing accelerator by bustom-made,and the amounts of nano- montmorillonite were analyzed.

关 键 词：酚醛环氧树脂 甲基苯基硅树脂 硼酚醛树脂 耐高温胶粘剂 

分 类 号：TQ433.437[化学工程]