高强高导纳米复合材料CuCrZr/AlN的组织与性能  

Microstructure and properties of copper alloy based nano-AlN composite

作　　者：邓景泉[1] 吴玉程[1] 王文芳[1] 黄新民[1] 

机构地区：[1]合肥工业大学材料学院,合肥230009

出　　处：《中国有色金属学报》2007年第3期428-433,共6页The Chinese Journal of Nonferrous Metals

基　　金：安徽省"十五"二期科技攻关资助项目(040020392);合肥市重点科技攻关资助项目(20051044)

摘　　要：采用粉末冶金方法制备高强高导铜合金基纳米复合材料(CuCrZr/AlN),用TEM、SEM等方法研究不同工艺条件如温度、压力、复压压力及复烧温度对复合材料组织与性能的影响。结果表明:烧结后的试样密度随压力、烧结温度的升高而增大,复压复烧后致密度达98%;试样抗弯强度随密度的增大而增大,复压复烧后,试样最大抗弯强度达到417MPa;600MPa复压950℃复烧试样的软化温度大于600℃;烧结温度为950和900℃,相对应的晶粒尺寸分别是0.26～0.44μm和0.1～0.21μm;材料的电导率随着密度的增大而增大,复压复烧后可以达到62%(IACS)。The spot welding copper alloy based composite was prepared using PM method with high strength and high conductivity. The different preparing conditions such as pressure, sintering temperature, repressure and resintering temperature influences on microstructure and properties were also studied using TEM and SEM. The results show that the density increases with increasing pressure and sintering temperature and the buckling strength increases with increasing density. After repressure and resintering, the highest buckling strength reaches 417 MPa. The conductivities of the materials increase with increasing densities within certain range and reach 62%（1ACS）. The sintering temperatures are 950 and 900℃ and their grain sizes are 0.26-0.44 μm, 0.1-0.21 μm, respectively. Its softening temperature is bigger than 600 ℃.

关 键 词：CuCrZr/AlN 纳米复合材料 粉末冶金 电导率 

分 类 号：TB331[一般工业技术—材料科学与工程] TF125.2[冶金工程—粉末冶金]