Diffusion bonding of Ti-6Al-4V to ZQSn10-10 in vacuum  

作　　者：宋敏霞 赵熹华 郭伟 冯吉才 黄达 

机构地区：[1]College of Materials Science and Engineering,Jilin University,Changchun,130022.Feng Jicai,Harbin Institute of Technology, Harbin, 150001 [2]Harbin Institute of Technology,Harbin, 150001

出　　处：《China Welding》2007年第1期1-5,共5页中国焊接（英文版）

基　　金：This research was supported by National Natural Science Foundation of China(No 50375065);State Key Laboratory of Advanced Welding Production Technology(04005)

摘　　要：The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.

关 键 词：TI-6AL-4V ZQSn10-10 diffusion bonding intermetallic compound 

分 类 号：TG456[金属学及工艺—焊接]