电子元件散热的优化分析  

OPTIMIZE ANALYSIS ON THE HEAT DISSIPATION OF ELECTRONIC ELEMENTS

作　　者：云和明[1] 程林[1] 陈宝明[2] 杜文静[1] 

机构地区：[1]山东大学空间热科学技术中心,山东济南250061 [2]山东建筑大学,山东济南250101

出　　处：《工程热物理学报》2006年第3期496-498,共3页Journal of Engineering Thermophysics

基　　金：国家重点基础研究发展规划项目资助(高效节能的关键科学问题(No.20000263)

摘　　要：本文采用CFD技术对小空间中的电子元件的散热进行了研究,模拟了以空气为冷却流体的多种方案下小空间的温度场和速度场,基于场协同原理对其温度场和速度场的协同效果进行了分析。在此基础上提出一种评价电子元件冷却效果的冷却效果数,并以此为指标得出小空间电子元件散热的优化方案和最优间距,为进一步探讨微电子元件的冷却技术打下了基础．The heat dissipation of electronic elements in a mini-space is investigated by using Computational Fluid Dynamics （CFD） methods in this paper. The velocity and temperature fields of mini-space are simulated on the condition of several schemes with air as fluid. The synergetic effects of temperature and velocity field for mini-space have been analyzed by field coordination principle. Then a cooling effect number has been put forward to evaluate the cooling effects of electronic elements. The optimized scheme of mini-space and optimized space between of electronics has been obtained by comparing the cooling effect number of different schemes, which has established a solid foundation for discussing the cooling techniques of micro-electronic elements further.

关 键 词：场协同 CFD 电子元件 热设计 

分 类 号：TK124[动力工程及工程热物理—工程热物理]