涂料用抗菌防霉剂吡啶硫酮铜的制备研究  

Study on Preparation of Copper Pyrithione as Fungicide for Coatings

作　　者：张珍明[1] 李树安[1] 卞玉桂 葛洪玉[1] 

机构地区：[1]淮海工学院化学工程系,江苏连云港222005

出　　处：《涂料工业》2007年第4期11-12,20,共3页Paint & Coatings Industry

基　　金：江苏省高校高新技术产业发展项目(JHB05-50)

摘　　要：吡啶硫酮铜（CPT）是涂料用高效低毒的抗菌防霉剂。本文以吡啶硫酮钠盐和硫酸铜为原料，在pH值为8．5和温度70～75℃下搅拌反应2h得到硫酮铜，收率为97．7％，含量大于99．3％。研究了吡啶硫酮钠盐与硫酸铜投料比、pH值和温度等因素对吡啶硫酮铜制备反应的影响。Copper pyrithione is an effective fungicide with low toxicity used for coatings. Sodium pyrithione is reacted with CuSO4 at pH = 8.5 and 75 ℃ for 2h to produce copper pyrithione with the yield of 99.7% and purity of 99. 3%. The effects of ratio of sodium pyrithione to copper sulfate, temperature and pH value on the yield of copper pyrithione is also discussed.

关 键 词：吡啶硫酮铜 吡啶硫酮钠 抗菌防霉剂 

分 类 号：TQ630.4[化学工程—精细化工]