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作 者:刘卫红[1] 孙大谦[2] 孙德新[2] 贾树盛[2]
机构地区:[1]北京航空材料研究院,北京100095 [2]吉林大学材料科学与工程学院,长春130025
出 处:《焊接学报》2007年第3期57-60,共4页Transactions of The China Welding Institution
摘 要:用纯金属作中间层TLP连接颗粒增强铝基复合材料,接头存在增强相偏聚区,是接头力学性能的薄弱区域。控制增强相偏聚区是改善接头力学性能的一种有效途径。文中尝试用Cu,Al金属复合中间层TLP连接Al2O3P/6061Al复合材料,探讨了其接头的显微结构和力学性能特点。结果表明,用Cu,Al金属复合中间层能够控制接头增强相偏聚,改善接头抗剪强度。在连接温度600℃,保温时间60 min的工艺条件下,10μm Al/10μm Cu/10μm Al复合中间层接头增强相偏聚明显下降,接头抗剪强度110 MPa;1.5μm Cu/10μm Al/1.5μm Cu复合中间层接头无明显的增强相偏聚,接头抗剪强度123 MPa。The joint of transient liquid phase bonding of particle reinforced aluminium-based metal matrix composite with a pure metal interlayer contains a particle segregation region,which is deleterious to the joint strength.Decreasing particle segregation is one of effective approaches improving mechanical properties of the joint.The microstructure and mechanical property of aluminium-based metal matrix composite Al2O3P/6061Al joint by transient liquid phase bonding with Al/Cu/Al or Cu/Al/Cu multi-layer interlayer have been investigated.The experimental results show that bonding with the multi-layer interlayer is able to control the particle segregation region and improve the joint strength.Under the bonding condition of 600 ℃/60 min,with 10 μm Al/10 μm Cu/10 μm Al multi-layer interlayer,the particle segregation region is not evident in the joint,and the shear strength of the joint is 110 MPa;with 1.5 μm Cu/10 μm Al/1.5 μm Cu multi-layer interlayer,the particle segregation region is invisible in the joint,and the shear strength of the joint is further increased to 123 MPa.
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