化学镀法制备镍包铜复合粉末及其烧结行为  

NICKEL PLAT COPPER POWDER AND ITS SINTERING

作　　者：刘国瑞[1] 陈学定[1] 康凯[1] 彭彪林[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃兰州730050

出　　处：《粉末冶金工业》2007年第2期20-25,共6页Powder Metallurgy Industry

基　　金：国家863计划项目(2003AA32X150)

摘　　要：用化学镀法制备了镍包铜粉,并利用固相烧结法将镍包铜粉成功地制成了块状烧结体。通过SEM、XRD与EDS分析研究了烧结过程中镍包铜粉中界面的迁移情况,同时制备了镍铜混合粉末烧结体并和镍包铜粉末烧结体进行了对比。结果表明:镍包铜粉烧结体在扩散过程中,由于镍的扩散系数比铜大,镍层扩散进入铜形成了铜镍固溶体,界面单向迁移。随烧结温度升高,颗粒内原子扩散系数越大,烧结体界面扩散越容易,形成较大的晶粒,同时镍包铜粉烧结体能克服镍铜混合粉烧结产品中的组织偏析。Nickel plat copper powders were prepared by electrolytic plating and bulk sinters of nickel-coated copper powders were prepared by sintering. The interface migration during sintering,was studied by using SEM,XRD and EDS at the same time,the sinters of Cu-Ni mixed powders were compared with. It was shown that the nickel atoms diffuse into copper layer leading formation of Cu-Ni solid solution for the diffusion coefficient of nickel is larger than that of copper, and the interface migration is unidirectional. The diffusion coefficient of atoms increases with sintering temperature, and the interface in specimens moves and grains grow more easily,On the other hand,the segregation occurred in the sinters of Cu-Ni mixed powders canbe avoided.

关 键 词：镍包铜复合粉末 烧结 扩散 偏析 

分 类 号：TF124.5[冶金工程—粉末冶金]