金属微孔网板微细电解加工技术研究  

Preparation of Metallic Micro-screen Plate by MicroElectrochemical Machining

作　　者：王磊[1] 朱荻[1] 曲宁松[1] 王明环[1] 

机构地区：[1]南京航空航天大学机电工程学院,江苏南京210016

出　　处：《电加工与模具》2007年第2期24-27,共4页Electromachining & Mould

基　　金：国家自然科学基金资助项目(503750730);江苏省自然科学基金资助项目(BK2004126);南京航空航天大学科技创新基金资助项目(Y0489-052)

摘　　要：提出了采用微细圆柱群电极电解加工金属网板微孔的工艺方法。以电化学腐蚀法制备了直径(72μm)一致的单排微细圆柱群电极,并用此群电极为工具阴极,进行了网板微孔的电解加工工艺试验,实现了金属微孔网板的稳定电解加工。Fabrication technology of metallic micro-screen plate with multiple cylindrical microelectrodes by micro-ECM is proposed. Multiple cylindrical micro-electrodes with uniform diameter and 72μm diameter size are fabricated by electrochemical etching. Experiments on preparation of microscreen plate with the multiple electrodes by micro-ECM are carried out, and stable machining of microscreen plate by micro-ECM is realized.

关 键 词：微细电解加工 群电极 微孔网板 

分 类 号：TG662[金属学及工艺—金属切削加工及机床]