冷变形对表面弥散强化铜合金组织与性能的影响  

Influence of Cold Deformation on Microstructures and Properties of Surficial Dispersion-strengthening Copper Alloy

作　　者：国秀花[1] 宋克兴[1] 郜建新[1] 张晓楠[1] 刘瑞华[1] 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003

出　　处：《铸造技术》2007年第1期53-56,共4页Foundry Technology

基　　金：河南省重点科技攻关项目(0523021500);河南省高校杰出科研人才创新工程项目(2007KYCX008);河南科技大学重大预研科学研究基金资助(2005ZD003);河南科技大学人才科学研究基金资助

摘　　要：以Cu2O为氧源,对Cu-Al合金平板试样进行了内氧化处理,使试样表面获得A12O3弥散强化铜合金层,并进行了不同变形量的冷轧变形;测定了内氧化前后和冷变形前后试样硬度和导电率,并进行了微观组织观察。结果表明:内氧化处理后,合金表面硬度与合金导电率大幅度提高;随着变形量的增加,合金表面硬度值急剧升高,而电导率随着变形量的增加则略有下降。微观组织研究表明:内氧化后合金表面存在大量的纳米级Al2O3颗粒,使合金表面具有高的硬度;随着变形量的增加,位错密度升高,位错与第二相粒子的作用加剧,从而使合金表面的硬度进一步提高;同时由于A12O3颗粒周围位错缠结的增多,增强了电子的散射作用,导致合金电导率随变形量增加呈下降趋势。The Cu-Al alloy plate was firstly treated by internal oxidation with Cu2O as oxidizer, and got a dispersion-strengthened Al2O3 layer on the plate surface, followed by cold deformation with different rate. The hardness and electrical conductivity before and after internal oxidation and cold deformation were measured and their microstructures were studied, Results show that the hardness and electrical conductivity of the alloy increases greatly after internal oxidation;the hardness of the alloy surface increases greatly with increase of cold deformation, however, the electrical conductivity decreases slightly. The microstructure reveals that the strengthening of the alloy surface is mainly attributed to the presence of the nano-scale alumina particles anchoring in the copper matrix, which can hamper dislocation movement and increase dislocation density as dislocation source with increase of the cold deformation. Meanwhile, the nano-scale alumina particles which cause dislocation tangle in cold deformation can enhance the electron scattering, so the electrical conductivity decrease gently.

关 键 词：内氧化 冷变形 铜合金 硬度 电导率 

分 类 号：TG113[金属学及工艺—物理冶金]