复合稳定剂对化学镀镍-磷合金的影响  

Influence of Compound Stabilizers on Electroless Ni-P Alloy Plating

作　　者：尹国光[1] 张自广[1] 吴文锟[1] 

机构地区：[1]泉州师范学院化学系,福建泉州362000

出　　处：《材料保护》2007年第4期28-29,共2页Materials Protection

摘　　要：为满足化学镀镍对镀液稳定性、沉积速率和镀层性能的要求，研究了化学镀Ni-P合金的多种复合稳定剂组合。对镀液稳定性、沉积速率以及镀层的孔隙率、耐蚀性和结合力进行了测试。结果表明，使用优选的复合稳定剂ZD（由不饱和有机酸、无机盐和含硫化合物复配而成），在86～88℃下，向50mL化学镀液中加入100mg／L的PdCl2溶液3mL，243s无沉淀；镀层孔隙率为0．06个／cm^2，耐浓硝酸时间为171s，镀速为18．5μm／h。结合力满足GB／T13913-92要求。该复合稳定剂协同效果好，不合重金属离子，符合环保要求。The effects of various compound stabilizers on the stability and deposition rate of the plating bath,and the porosity,corrosion resistance,and adhesion of the electroless Ni-P alloy coatings were investigated,which was aiming at development of the combined stabilizers suitable to the electroless Ni-P plating.It was found that the compound stabilizer ZD(composed of unsaturated organic acid,inorganic salt,and S-containing compound) had good stabilizing capacity for the electroless Ni-P plating bath.Namely,50 mL of the bath solution containing 3 mL of 100 mg/L PdCl2 could remain stable up to 243 seconds at a temperature of 86~88 ℃ in the presence of the combined stabilizer.The corresponding Ni-P coating had a decreased porosity of 0.06 cm2,anticorrosion lifespan of 171 seconds in concentrated HNO3,deposition rate of about 18.5 μm/h,and adhesion to substrate meeting with the specification of GB/T 13913-92.Moreover,the compound stabilizer ZD had no heavy metal ions and showed good synergistic stabilizing capacity,while it was environmentally acceptable as well.

关 键 词：化学镀NI-P合金 复合稳定剂 稳定性 孔隙率 镀速 

分 类 号：TQ153.2[化学工程—电化学工业]