用有机硅树脂YR3370连接RBSiC陶瓷  

Joining RBSiC Ceramic with Silicon Resin YR3370

作　　者：原效坤[1] 李树杰[1] 张听[1] 

机构地区：[1]北京航空航天大学材料科学与工程学院,北京100083

出　　处：《航空学报》2007年第2期451-455,共5页Acta Aeronautica et Astronautica Sinica

基　　金：航空科学基金(03H51024)

摘　　要：以一种聚硅氧烷类有机硅树脂YR3370(GE Toshiba Silicones)为连接剂,连接了反应烧结SiC(RB-SiC)陶瓷。连接件在1100～1300℃的99.99%N2气流中进行热处理。用三点弯曲强度实验测定连接件的强度,用场发射扫描电镜、X射线衍射和热重测试分析显微结构和化学反应。在连接温度为1200℃时,连接件的三点弯曲强度达到最大值197MPa。连接层是由有机硅树脂YR3370裂解生成的无定形SixOyCz陶瓷,其结构连续均匀致密,厚度在2～5μm之间。连接机理是通过无定形SixOyCz陶瓷的无机粘接作用在RBSiC陶瓷基体和连接层之间形成连续的化学键。Ceramic joints between reaction-bonded silicon carbide （RBSiC） were produced using a polysioxane silicon resin YR3370 （GE Toshiba Silicones） as joining material. Samples were heat treated in a 99.99 % nitrogen flux at temperatures ranging from 1 100 to 1 300 ℃. The strength of the joints was determined by three point bending test. Microstructural and microchemical analyses were performed by FESEM,XRD and TG analysis. The three point bending strength of the joint at 1 200℃ reached the maximum of 197 MPa. The join layer was the amorphous silicon oxycarbide ceramic pyrolyzed from silicon resin YR3370, which was fairly continu ous, homogeneous and densified and had a thickness of 2-5μm. The joining mechanism is that the amorphous silicon oxycarbide ceramic acts as an inorganic adhesive by the formation of continuous chemical bonds between the RBSiC substrate and the joining layer.

关 键 词：有机硅树脂 YR3370 SIC陶瓷 陶瓷连接 

分 类 号：V254.2[一般工业技术—材料科学与工程] TB332[航空宇航科学与技术—航空宇航制造工程]