热循环拉伸SiCw/6061Al复合材料变形与断裂行为研究  

The Deformation and Fracture Behavior of SiCw/6061AL Composite under Thermal Cycling

作　　者：熊征[1] 姚忠凯[2] 

机构地区：[1]海军工程学院 [2]哈尔滨工业大学

出　　处：《材料科学与工艺》1997年第1期19-23,共5页Materials Science and Technology

摘　　要：研究了热循环拉伸ＳｉＣｗ／６０６１Ａｌ复合材料变形与断裂过程。结果表明，热循环产生的界面应力有助于ＳｉＣｗ／６０６１Ａｌ复合材料的塑性变形；热循环低应力拉伸变形主要是位错的攀移；快速冷却时的过饱和空位既有助于位错的攀移，又能促使孔洞长大；ＳｉＣｗ／６０６１Ａｌ复合材料的断裂过程是孔洞形成、长大和连接；孔洞形成与热循环诱导的界面应力和ＳｉＣ晶须及基体中夹杂物有关。In this paper by thermal cycling tensile testing,the deformation and fracture behavior of SiCw/6061AL composite were studied. The results obtained from the experimental and analyses showed that the interral stresses indueed by thermal cycling were conducive to the plastic deformation of SiCw/6061AL composite. During thermal cycling, the plastic deformation in lower applied stress relyed on the climb of a disslocation. The oversaturated vacancy at fast cooling was a great help to the climb of a disslocation and the growth of viods; the tensile fracture processes of SiCw/6061ALcomposite under thermal cycling included the form.growth. links of viods, and the form of viods had a relation to SiC whisker or inrclsions and the internal stresses induced by thermal cycling.

关 键 词：铝基 复合材料 变形行为 热循环 

分 类 号：TB333[一般工业技术—材料科学与工程]