利用WinSock实现半导体封装设备的通信  

Semiconductor Packaging Equipment Communication Using WinSock

作　　者：徐震[1] 王晓初[1] 何永基 易理告[1] 

机构地区：[1]广东工业大学机电工程学院,广州510090 [2]艾逖恩控股有限公司,广东深圳518001

出　　处：《半导体技术》2007年第3期202-204,共3页Semiconductor Technology

基　　金：国家自然科学基金项目(50475044):广东省招标项目(2004A10403015);广东省自然科学基金项目(04300155);广州市科技攻关项目(2006Z3-D9071)

摘　　要：Socket接口是TCP/IP的API,TCP/IP网络中的应用程序,是通过Socket实现的。WinSock是一套开放的、支持多种协议的Windows下的网络编程接口。介绍了利用WinSock进行网络编程的一般方法,并在此基础上解决了半导体封装设备使用TCP/IP协议进行网络实时通信的问题,实现了在服务器和客户机两端准确方便地实时发收文件和互相通信,并测试了发收不同大小文件所消耗的平均时间。Socket interface was well developed to simply the TCP/IP networking. In particular, Windows Sockets （WinSock） is a successfully and widely open source which supports many protocols interface and makes network programming an effortless task in Windows. A general investigation on the application of the TCP/IP on semiconductor packaging equipment was introduced, based on it the issues of the TCP/IP protocol for network communication of semiconductor packaging equipments was solved. The average time of data transferring was measured under different situations to establish the feasibility on its application on the semiconductor equipment.

关 键 词：TCP/IP 网络通信 WINSOCK 半导体封装设备 

分 类 号：TP393.09[自动化与计算机技术—计算机应用技术]