微生物法处理电镀废水的进展  

Progress of Electroplating Wastewater Treatment with Microorganism Method

作　　者：青志鹏[1] 黄瑞敏[1] 王章霞[1] 

机构地区：[1]华南理工大学环境学院环境工程系,广东广州510640

出　　处：《电镀与精饰》2007年第3期21-24,共4页Plating & Finishing

摘　　要：综述了目前较受关注的生物法处理电镀废水技术,对该方法国内外研究的主要方向如功能菌分离,提高生物吸附性能以及工艺优化等进行了介绍和评述。同时提出尚待解决的一些问题,并对微生物法处理电镀废水发展趋势作了展望。The technology of electroplating wastewater treatment was introduced. The current application situation and trend of using microbiological method development of electroplating wastewater treatment technologies were commented, such as separating functional bacteria, advancing the adsorbability of microorganism and optimizing the treatment process were reviewed. The existing problems of the technology were discussed and the prospects were presented.

关 键 词：微生物法 电镀废水 功能茵 生物吸附 

分 类 号：X781.1[环境科学与工程—环境工程]