铝基化学镀Ni-P合金工艺研究  

Study on Technology of Electroless Ni-P Alloy Plating on Aluminum Substrate

作　　者：万家瑰[1] 李淑华[1] 冯小军[1] 

机构地区：[1]大庆石油学院材料科学与工程系,黑龙江大庆163318

出　　处：《电镀与精饰》2007年第3期42-44,共3页Plating & Finishing

摘　　要：通过改进铝基化学镀的前处理工艺,采用酸蚀法对铝进行前处理,在铝基上直接进行化学镀Ni-P合金,可以获得光亮、平整、结合力好的镀层。通过实验确定了铝基化学镀Ni-P合金的工艺流程,并讨论了各因素对镀层沉积速率的影响。Pretreatment technology for electroless plating on aluminum substrate was improved. Electroless Ni-P alloy plating was conducted immediately after a special acid pickling step for the aluminum substrate, and a bright, smooth and good adhesion Ni-P alloy coating was obtained on the aluminum substrate. A technological process for electroless Ni-P alloy plating on aluminum substrate was established through experiments. Effect of various factors on deposition rate of the coating was discussed as well.

关 键 词：铝基材 化学镀Ni—P 酸蚀法 

分 类 号：TQ153.2[化学工程—电化学工业]