碱性无氰镀铜工艺研究  

A study on Alkaline Cyanide-free Copper Plating Technology

作　　者：蔡爱清[1] 王建华[1] 曹相锋[1] 

机构地区：[1]中国人民解放军第4723工厂六车间,河北永年057150

出　　处：《电镀与精饰》2007年第3期45-47,共3页Plating & Finishing

摘　　要：通过对碱性无氰镀铜工艺、镀液及镀层性能研究,得到该工艺可作为钢铁基体的预镀铜,也可直接用于镀厚铜,镀层与基体的结合力良好,结晶细致,光亮。镀液成分简单,易操作,稳定,具有良好的分散能力,电流效率也优于氰化镀铜。Alkaline cyanide-free copper plating process was studied. An alkaline cyanide-free copper plating technology suitable for copper preplating on iron and steel substrates and for directly thick copper plating was established through tests of properties of plating bath and the coatings. The plating bath is simple in composition, easy in operation and is stable. Throwing power and covering power of the bath are excellent. Current efficiency of the alkaline cyanide-free copper plating bath is better than that of cyanide copper plating bath. Coating obtained from the bath is bright, fine in crystal size and has good adhesion with substrate.

关 键 词：碱性无氰镀铜 预镀铜 结合力 

分 类 号：TQ153.14[化学工程—电化学工业]