Ni-P合金在3.5%NaCl溶液中的溶解行为  

Dissolution Behavior of Electroless Ni-P Alloy Coating on Copper Substrate in Aqueous Solution of Sodium Chloride

作　　者：唐永明[1] 杨文忠[1] 刘瑛[1] 尹晓爽[1] 王锦堂[1] 

机构地区：[1]南京工业大学理学院,江苏南京210009

出　　处：《材料保护》2007年第5期24-26,共3页Materials Protection

基　　金："十五"国家科技攻关项目(2004BA313B14)

摘　　要：在铜基体上制备了磷含量为8.3%(质量分数)的化学镀Ni-P合金镀层,采用循环伏安、扫描电镜(SEM)、X光电子能谱(XPS)等方法研究了Ni-P合金在3.5%NaCl溶液中的溶解行为。结果表明,在静态低电位扫描速度下,Ni-P合金的溶解速度增大,而在旋转电极上,低的扫描速度可加速合金进入钝态,而且形成的钝化膜难以还原。合金在高阳极电位下形成的氧化层中含有NiO和PO43-,而且此层中发生了磷的富集。Electroless Ni-P alloy coating with a P content of 8.3%(mass fraction) was prepared on copper substrate via autocatalytic deposition.The dissolution behavior of the resulting Ni-P alloy coating in the aqueous solution of 3.5% NaCl was studied by means of cyclic voltammetric measurement,scanning electron microscopy,and X-ray photoelectron spectroscopy.It was found that the dissolution of the Ni-P alloy coating was accelerated when it was subjected to static scanning at a lower rate.Moreover,the passivation of the Ni-P alloy coating as a rotating electrode was promoted at a decreased scanning rate,and it was difficult for the passive layer to be reduced.In addition,the oxidation layer formed on the Ni-P alloy coating at a high anodic polarization potential contained NiO and phosphatanion and phosphorus was enriched in the oxidation layer as well.

关 键 词：NI-P合金 化学镀 溶解行为 循环伏安 

分 类 号：TG174.4[金属学及工艺—金属表面处理]