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作 者:刘峰
机构地区:[1]陕西航空电气有限责任公司,陕西兴平713107
出 处:《材料保护》2007年第5期40-42,共3页Materials Protection
摘 要:研究出了一种新型不含铅的全光亮化学镀镍工艺,获得了全光亮的镍磷合金镀层。通过试验分析镀液中添加剂、无机盐、主盐、施镀时间、pH值和施镀温度对化学镀镍磷合金层光亮度的影响;检测了有关性能。结果表明:所得化学镀镍磷合金镀层的光亮度、耐蚀性等性能优于常规化学镀镍磷合金镀层。CuSO4、TaSO4无机盐的添加使溶液稳定性(氯化钯稳定试验)从30s提高到90s,同时也提高了化学镀镍磷合金镀层耐蚀性,在5%NaCl溶液中的年腐蚀量从1.1mg/cm2降为0。A lead-free process for electroless plating of all-bright nickel was established,and an all-bright Ni-P alloy coating was prepared using the established electroless plating process.At the same time,the effects of additives,inorganic slats,primary slats,plating duration,and the pH value and temperature of the plating bath on the brightness and corrosion resistance of the target Ni-P alloy coating were investigated.It was found that the electroless Ni-P alloy coating prepared using the new plating process had better brightness and corrosion resistance than the one prepared using conventional electroless nickel plating process.The introduction of the inorganic salts such as CuSO4 and TaSO4 led to an increasing in the stability of the plating bath(stability test in PdCl) from 30 s to 90 s,and increased the corrosion resistance of the Ni-P alloy coating as well.Namely,the Ni-P alloy coating prepared using the new plating process had zero corrosion loss as immersed in 5% NaCl solution for one year,much less than that of the Ni-P alloy coating prepared using conventional plating process which was 1.1 mg/cm2.
分 类 号:TQ153.2[化学工程—电化学工业]
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