微胶囊自修复智能复合材料断裂特性的模拟实验研究  

Analog measueament of fracture feature of capsuling self-repairing smart composites

作　　者：贺跃进[1] 张军[1] 党旭丹[1] 张恒[1] 

机构地区：[1]郑州大学复合材料设计与应用研究所,河南郑州450052

出　　处：《功能材料》2007年第5期849-852,共4页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(10472106)

摘　　要：微胶囊型自修复复合材料设计的关键是基体材料和胶囊壳体材料的断裂韧性要在一定的范围内,使得基体材料的断裂特性和胶囊壳体材料的断裂特性达到最佳的匹配,这样才能保证自修复过程的实现。为得到这种匹配关系,首先对环氧树脂、不饱和聚酯和尼龙等基体材料试件进行了断裂韧性测定。然后从上述基体材料中以不同的材料组合制备出9种组配的夹层试件,每种组配所选用的两种材料(基体材料和夹层材料)的KIC值有差值ΔKIC。实验表明,在同样界面强度条件下,当基体材料和夹层材料的断裂韧性差值ΔKIC<89669Pa.m1/2时,裂纹绕过夹层;而当ΔKIC>89669Pa.m1/2时,裂纹穿过夹层。对模拟胶囊试件的实验验证了上述结论的正确性。In designing capsuling self-repairing smart composites, the key factor is to control the fracture features of basement material and capsuling material, and have them primely matched. For this reason, the fracture toughness of epoxy resin, unsaturated polyester and nylon is firstly tested. Then, nine different interlayer specimens are made, and each specimen has a difference between basement toughness and interlayer toughness, called △KIC. Experiment indicate that, when △KIC is under 89669Pa · m^1/2, crack will bypass the interlayer; when △KIC is above 89669Pa · m^1/2, crack will go through the interlayer. This conclusion is verified by the experiment of analog capsuling specimens.

关 键 词：自修复 夹层材料试件 胶囊材料试件 断裂韧性匹配 

分 类 号：TB381[一般工业技术—材料科学与工程]