BGA基板切割过程中唇缘效应的产生及改进措施  

Causation and Improvement of Lip Effect in BGA Substrate Singulation Process

作　　者：袁洁[1] 赵宁[1] 南俊马[1] 憨勇[1] 徐可为[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室

出　　处：《半导体技术》2007年第5期443-446,共4页Semiconductor Technology

基　　金：陕西省工业攻关项目(2005K06-G8)

摘　　要：采用两种不同结合剂硬度的金刚石刀片切割同一种BGA基板,通过对刀片刃口形貌的变化以及切割断面的分析,探讨了唇缘效应产生的原因。结果表明,在金刚石浓度、粒度及切割工艺等条件相同的情况下,刀片结合剂硬度是造成唇缘效应的最主要因素,并提出了避免唇缘效应产生的改进措施。Two kinds of diamond blades of different hardness of metal matrix materials for cutting BGA substrate were used to compare the cutting performance. The causation of lip effect was discussed by analyzing the change of shape of blades edge and the cross section of BGA die. The results show that it is much easy to occur the lip effect by using much harder metal matrix materials under the same conditions of the diamond concentration and grits size and the cutting parameters. It reveals that the hardness of the metal matrix is the main factor that induces the lip effect, and the improvements were provided.

关 键 词：唇缘效应 金刚石刀片 结合刳硬度 BGA基板 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]