新型电子环氧塑封材料研究进展  

作　　者：刘振宇[1] 朱瑜芳[2] 

机构地区：[1]桂林电子科技大学机电工程学院 [2]北京化工大学

出　　处：《现代表面贴装资讯》2007年第2期37-41,共5页Modern Surface Mounting Technology Information

摘　　要：介绍了环氧树脂塑封料（Epoxy Molding Compounds，EMC）的起源和发展和过程；简述了环氧树脂塑封料的组成、典型配方和制造工艺；分析了环氧树脂塑封料的性能优点、弊端以及正在面临的巨大挑战；总结了国内外近期在环氧树脂塑封料研究上的新进展。Introduced the origin, developing process and present situation of Epoxy Molding Compounds（EMC）; represented the composition, typical formula and manufacture craft of EMC; the performance merits and demerits of EMC was analyzed; the huge challenges that EMC is facing were discussed; summarized the new progress on the research of EMC in domestic and foreign countries in the past few years, among which the performance and the structure of halogen-free flame-retarded EMC as well as bear lead-free EMC were emphatically introduced.

关 键 词：环氧树脂塑封料 配方 无卤阻燃 耐无铅 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]