APG工艺用环氧树脂体系的固化及流变模型  

Cure kinetics and chemorheological model of epoxy resin mixture used in APG process

作　　者：张赛军[1] 袁宁[1] 阮锋[1] 

机构地区：[1]华南理工大学机械工程学院,广东广州510640

出　　处：《合成树脂及塑料》2007年第3期20-24,共5页China Synthetic Resin and Plastics

基　　金：广东省工业攻关项目(2003C102023)

摘　　要：研究了自动压力凝胶工艺用环氧树脂混合体系在动态升温过程中的固化反应,采用Malek法确定了动力学模型并预测了相应的参数。该体系符合两参数自催化SB模型。用旋转流变仪测定了该体系在动态升温过程中黏度相对于温度的变化曲线,采用WLF和Macosko混合方程描述该体系的化学流变模型,用非线性拟合方法预测了模型中的参数。模型预测与实验数据比较吻合。This paper studied curing reaction of epoxy resin blended system in dynamic temperature-rise course, which was available in automatic pressure gelation technology（APG）. Malek process was adopted to determine the kinetic model of the system in APG and forecasted the corresponding parameters. The results reveal that the system conforms to two-parameter autocatalytic SB model. The variation curve of the system＇s viscosity with temperature in the dynamic temperature-rise course is measured with a rotary rheometer. The chemorheological model of the system is described with the combined WLF and Macosko equation; the parameters of the model are predicted by means of non-linear fit method. The anticipation made with the model substantially accorded with the experimental data.

关 键 词：环氧树脂 自动压力凝胶 化学流变模型 固化动力学 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]